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Our Platforms 2018-09-14T20:41:55+00:00

AIM Workcells 

Jabil’s Automated Inline Module (AIM) platform utilizes interchangeable modules to automate a wide range of basic to complex production applications. Pre-engineered solutions minimize risks, simplify integration and reduce lead-time. AIM platforms can be used inline or as stand-alone workstations.

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Features

  • Platforms can be configured in any orientation ensuring optimal support of interrelated processes, production speeds, and quality

  • Modular Z-axis and optional Theta axis
  • Vision location options (up-camera or down-camera)
  • Standardized mounting flanges and control interfaces
  • Quick-change feeder mounting
  • OSHA and ANSI compliant

Benefits

  • Redeployable. Protect your investment by redeploying your AIM workcell. Designed with common interfaces, the unit enables rapid change-over of applications. Want to take a point to point soldering unit and change it to screwdriving? No problem.
  • Multiple Levels of Automation. The flexible AIM platform supports a wide range of processes, from semi-automatic to fully-automated.
  • Flexibility. AIM platforms can be set up in a variety of configurations to support any number of interrelated processes, production speeds and quality. You can configure pallet or edge-belt conveyors with a reversible left-to-right or right-to-left conveyor flow.

CHAD IQps

The CHAD IQps is a low-cost automation platform that offers an ideal solution for odd-form pick-and-place and other circuit assembly applications. Easy-to-use motion and vision controls plus the incorporation of standard assembly tools provide great system flexibility.

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Features

  • EPSON 4-axis SCARA Robot with motion controller
  • Simple-to-use IQware application software and intuitive operator interface, via Windows PC and manual control pendant
  • Edge belt conveyor with board stop and board locating tooling, and board support
  • Optional Active or Programmable Lead clinch
  • Four quick-change feeder slots accept all standard Jabil Chad Automation part feeders
  • Options for 4, 6 and 10 feeders

  • Compatible with standard CHAD Grippers, including standard mechanical and vacuum grippers, plus the CHAD PIE compliant gripper
  • Ability to handle virtually all component types, including axials, radials, pin headers, DIPs, SIPs, transformers, relays, TO-220s, displays, LEDs, and more
  • Custom specifications can be accommodated
  • OSHA and ANSI compliant

Chad Automation IQps automation platform
Product Sheet
Specifications
Machine Footprint 1118mm x 1600mm
Work Envelope
  • With Clinch Envelope 76mm x 76mm to 356mm x 240mm
  • With Board Support 76 x 76mm to 356 x 254mm
Axes of Motion 4 Axes (X, Y, Z, T)
Z Max. Stroke 180mm
Theta 360°
Manipulator Payload Rated 3kg, Max. 6 kg (on Z-Axis)
Manipulator Repeatability
  • X, Y, Z ±50μm
  • T ±0.005°
Utility Requirements
  • Power 220VAC ±10%, 50/60Hz, 30 Amp
  • Air 5.2-6.9 bar, 57 L/min
Product Presentation Edge Belt Conveyor
Feeder Slots Available 4 Slots (6 and 10 slots optional)
Electrical I/O
  • User I/O 56 Inputs / 48 Outputs
  • Expansion I/O 27 Inputs / 20 Outputs (expandable by using stackable modules)
Pneumatic 14 Valves Wired
MES Connectivity Jabil IQware Visual Programming Environment
Controls
  • Advantech PC with Windows
  • Epson RC-180 Motion Controller
  • Epson Manual Control Pendant

WaferMate 300

The WaferMate300 is a highly configurable, BOLTS-compatible robotic wafer-handling cell that mates high performance with cost competitiveness. As an ISO Class-2 clean EFEM, this platform includes all applicable mini-environment components, E84 compliance and rear hand-off.

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Features

  • Pairs with all types of process tools and environments
  • Available in single and dual loadport configurations
  • Can service up to 3 process tools
  • 300mm automation platform, adaptable for 200mm and smaller substrates
  • Robots fitted with range of end effector technologies, including vacuum, Bernoulli, edge grip and more
  • Full safety guarding (OSHA and ANSI compliant)
  • Cleanliness Levels Down to ISO Class-2
  • CE, SEMI S2, and SEMI S8 Compliant

Standard Accessories

  • FOUP Opener
  • SMIF Pod Opener
  • Aligner

  • OCR

  • Barcode
  • RFID

  • Ionization Bars
  • Mini Environment
  • Wafer Flip Module
  • Pallet Transfer Station

  • Wafer Conveyor / Oven Interface
  • SMEMA & SECS/GEM Interfaces
Chad Automation WaferMate wafer handling machine with dual load ports
Product Sheet
Specifications
Machine Footprint 991mm (W) x 559mm (L) x 2063mm (T) (Single Loadport)
991mm (W) x 1041mm (L) x 2063mm (T) (Dual Loadport)
Wafer Alignment to ± .05°
Wafer Placement ±100µm
Clean Room Classification Up to ISO Class 2 (Optional)
Wafer Interface Options SMEMA, SECS/GEM
Cassette Positions Available Up to 4 x 200mm Cassettes
Loadport Positions Available 1 or 2
MTBF 60,000 hours
Compliance Standards CE, SEMI S2, SEMI S8
Uptime >97%
Handling Capabilities
  • Thin Wafers
  • Warped Wafers
  • Thick Wafers
  • Glass Wafers
  • Bonded Wafers
  • Perforated Wafers
  • Trenched Wafers
  • Taiko Wafers

WaferMate 200

The WaferMate200 is a high-performance wafer-handling platform, engineered for the expert automation of semiconductor wafers and similar substrates. The standard SMEMA interface provides the most cost-effective wafer-level process solution for systems that traditionally fit a conveyor layout.

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Features

  • Pairs seamlessly with multiple types of process tools
  • Configurable for two, three or four cassette positions
  • Suitable for all open cassette presentation formats
  • Suitable for 50mm to 200mm wafers or 300mm from shipping cassette
  • Can accommodate film frames, and special thin and warped wafer components
  • Full safety guarding (OSHA and ANSI compliant)
  • Cleanliness Levels Down to ISO Class-4
  • CE, SEMI S2, and SEMI S8 Compliant

Standard Accessories

  • Aligner
  • OCR
  • Barcode
  • Ionization Bars
  • Mini Environment
  • Wafer Flip Module
  • Pallet Transfer Station

  • Wafer Conveyor / Oven Interface
  • SMEMA & SECS/GEM Interfaces
Product Sheet
Specifications
Machine Footprint 1194mm (W) x 769mm (L) x 1812mm (T)
Wafer Alignment to ± .05°
Wafer Placement ±100µm
Clean Room Classification Up to ISO Class 4 (Optional)
Wafer Interface Options SMEMA, SECS/GEM
Cassette Positions Available Up to 4 x 200mm Cassettes
MTBF 60,000 hours
Compliance Standards CE, SEMI S2, SEMI S8
Uptime >97%
Handling Capabilities
  • Thin Wafers
  • Warped Wafers
  • Thick Wafers
  • Glass Wafers
  • Bonded Wafers
  • Perforated Wafers
  • Trenched Wafers
  • Taiko Wafers