• Our Platforms

CP150

A Flexible, High-Precision Automation Solution

The CP150 automation platform delivers future-proof flexibility to any production line by delivering a highly-modular, scalable system that addresses a variety of automation needs.

Enhanced Capabilities

Metrology. We design and deliver non-contact metrology solutions that increase production thoughput and repeatability.

Features:

  • Ability to identify cosmetic defects, coating thickness, gaps, and offsets
  • High-speed multi-angle light triggering
  • Custom AI Defect generation software

 

Optical Inspection. Our inspection capabilities allows you to identify and measure micron-level defects and surface flaws to ensure your products maintain the highest standards of quality.

Examples:

  • Cosmetic Defects
  • Coating Defects
  • Surface Finishes
  • Gaps and Offsets
  • Color and Gloss

 

Lamination. With the ability to align, place, and cure, our lamination capabilities delivers a streamlined process in your manufacturing processes.

Features:

  • Alignment repeatability within 10 microns
  • Scaleable for a variety of rigid and flexible material combinations
  • Non-contact “Bernoulli End-Effector” loading and unloading of materials
  • Automation Planarity Adjustment

 

High-Speed Final Assembly. When it comes to high-speed, high-precision assembly we deliver robust capabilities designed to help you achieve your manufacturing goals.

Examples:

  • Label Placement
  • Point-to-Point Soldering
  • Precision Dispensing
  • High-Speed Pick and Place
  • Vision Based Alignment
  • Robotic Screw Fastening

Key Features

  • Platforms can be configured in any orientation ensuring optimal support of interrelated processes, production speeds, and quality levels
  • Modular Z-axis and Theta axis (optional) available
  • Multiple Vision location options (up-camera or down-camera)
  • Standardized mounting flanges and control interfaces
  • Quick-change feeder mounting available
  • OSHA and ANSI compliant

Key Benefits

  • High-Flexibility. The CP Series allows for a variety of configurations that can support any number of interrelated processes, production speeds, and quality levels. Configure pallet or edge-belt conveyors with a either a reversible left-to-right or right-to-left conveyor flow to optimize your manufacturing processes.
  • Multiple Levels of Automation. The platform supports a wide range of processes, ranging from semi-automatic to fully-automated modes, to help support your manufacturing objectives.
  • Redeployable. Future proof your investment by re-deploying the CP Series workcell for various applications. Common interfaces enables rapid change-over of applications; saving you time and money.

CP150 Specifications

Specifications
Machine Footprint
  • 1495mm (w) x 1275mm (D) x 1800mm (H)
  • 1495mm (w) x 1275mm (D) x 2268mm (H) – With Light Tower
Work Envelope

700mm (X-axis) x 700mm (Y-axis)

Axes of Motion
  • 4 Axes (X, Y, Z, T) – Standard
  • 3 axes optional, Up to 16 axis compatible
Z Max. Stroke

100mm – Standard

Theta

360° – Standard

Manipulator Payload

Rated 3kg, Max. 6 kg (on Z-Axis) – Standard

Manipulator Repeatability
  • X, Y, Z ±25μm
  • T ±0.005°
Utility Requirements
  • Power 220VAC ±10%, 50/60Hz, 25 Amp
  • Air 5.2-6.9 bar, 57 L/min
Product Presentation

Edge Belt Conveyor, Pallet Conveyor, Manual Load, Dual Shuttle, Rotary Table

Feeder Slots Available

Feeders (Label, Tape, Reel, Tube), Tray Loader/Unloader, Manual Load Stack

Electrical I/O
  • User I/O – 24 VDC, 16 General Purpose Inputs / 16 General Purpose Outputs (NPN)
  • Expansion I/O – 16 Inputs / 16 Outputs per expansion card (NPN)
  • Remote I/O – 20 Inputs / 12 Outputs per Remote card (NPN)
Pneumatic

Remote valvebank(s) optional, Remote Vacuum Optional

MES Connectivity

Jabil ARVIS Visual Programming Environment

Controls
  • Advantech PC with Windows 10
  • Beckhoff TwinCAT3 Controller
  • ARVIS PC GUI

CHAD IQps

The CHAD IQps™ is a low-cost automation platform that offers an ideal solution for odd-form pick-and-place and other circuit assembly applications. Easy-to-use motion and vision controls plus the incorporation of standard assembly tools provide great system flexibility.

Features

  • EPSON 4-axis SCARA Robot with motion controller

  • Simple-to-use IQware™ application software and intuitive operator interface, via Windows PC and manual control pendant

  • Edge belt conveyor with board stop and board locating tooling, and board support

  • Optional Active or Programmable Lead clinch

  • Four quick-change feeder slots accept all standard Jabil Chad Automation part feeders

  • Options for 4, 6 and 10 feeders

  • Compatible with standard CHAD Grippers, including standard mechanical and vacuum grippers, plus the CHAD PIE™ compliant gripper

  • Ability to handle virtually all component types, including axials, radials, pin headers, DIPs, SIPs, transformers, relays, TO-220s, displays, LEDs, and more

  • Custom specifications can be accommodated

  • OSHA and ANSI compliant

Specifications
Machine Footprint

1118mm x 1600mm

Work Envelope
  • With Clinch Envelope 76mm x 76mm to 356mm x 240mm
  • With Board Support 76 x 76mm to 356 x 254mm
Axes of Motion

4 Axes (X, Y, Z, T)

Z Max. Stroke

180mm

Theta

360°

Manipulator Payload

Rated 3kg, Max. 6 kg (on Z-Axis)

Manipulator Repeatability
  • X, Y, Z ±50μm
  • T ±0.005°
Utility Requirements
  • Power 220VAC ±10%, 50/60Hz, 30 Amp
  • Air 5.2-6.9 bar, 57 L/min
Product Presentation

Edge Belt Conveyor

Feeder Slots Available

4 Slots (6 and 10 slots optional)

Electrical I/O
  • User I/O 56 Inputs / 48 Outputs
  • Expansion I/O 27 Inputs / 20 Outputs (expandable by using stackable modules)
Pneumatic

14 Valves Wired

MES Connectivity

Jabil IQware™ Visual Programming Environment

Controls
  • Advantech PC with Windows
  • Epson RC-180 Motion Controller
  • Epson Manual Control Pendant

WaferMate 300

The WaferMate300 is a highly configurable, BOLTS-compatible robotic wafer-handling platform that mates high performance with cost competitiveness. As an ISO Class-2 clean EFEM, this platform includes all applicable mini-environment components, E84 compliance and rear hand-off.

Features

  • Pairs with all types of process tools and environments

  • Available in single and dual loadport configurations

  • Can service up to 3 process tools

  • 300mm automation platform, adaptable for 200mm and smaller substrates

  • Robots fitted with range of end effector technologies, including vacuum, Bernoulli, edge grip and more

  • Full safety guarding (OSHA and ANSI compliant)

  • Cleanliness Levels Down to ISO Class-2

  • CE, SEMI S2, and SEMI S8 Compliant

Standard Accessories

  • FOUP Opener

  • SMIF Pod Opener

  • Aligner

  • OCR

  • Barcode

  • RFID

  • Ionization Bars

  • Mini Environment

  • Wafer Flip Module

  • Pallet Transfer Station

  • Wafer Conveyor / Oven Interface

  • SMEMA & SECS/GEM Interfaces

Specifications
Machine Footprint

991mm (W) x 559mm (L) x 2063mm (T) (Single Loadport)
991mm (W) x 1041mm (L) x 2063mm (T) (Dual Loadport)

Wafer Alignment

to ± .05°

Wafer Placement

±100µm

Clean Room Classification

Up to ISO Class 2 (Optional)

Wafer Interface Options

SMEMA, SECS/GEM

Cassette Positions Available

Up to 4 x 200mm Cassettes

Loadport Positions Available

1 or 2

MTBF

60,000 hours

Compliance Standards

CE, SEMI S2, SEMI S8

Uptime

>97%

Handling Capabilities
  • Thin Wafers
  • Warped Wafers
  • Thick Wafers
  • Glass Wafers
  • Bonded Wafers
  • Perforated Wafers
  • Trenched Wafers
  • Taiko Wafers

WaferMate 200

The WaferMate200 is a high-performance wafer-handling platform, engineered for the expert automation of semiconductor wafers and similar substrates. The standard SMEMA interface provides the most cost-effective wafer-level process solution for systems that traditionally fit a conveyor layout.

Features

  • Pairs seamlessly with multiple types of process tools

  • Configurable for two, three or four cassette positions

  • Suitable for all open cassette presentation formats

  • Suitable for 50mm to 200mm wafers or 300mm from shipping cassette

  • Can accommodate film frames, and special thin and warped wafer components

  • Full safety guarding (OSHA and ANSI compliant)

  • Cleanliness Levels Down to ISO Class-4

  • CE, SEMI S2, and SEMI S8 Compliant

Standard Accessories

  • Aligner

  • OCR

  • Barcode

  • Ionization Bars

  • Mini Environment

  • Wafer Flip Module

  • Pallet Transfer Station

  • Wafer Conveyor / Oven Interface

  • SMEMA & SECS/GEM Interfaces

Specifications
Machine Footprint

1194mm (W) x 769mm (L) x 1812mm (T)

Wafer Alignment

to ± .05°

Wafer Placement

±100µm

Clean Room Classification

Up to ISO Class 4 (Optional)

Wafer Interface Options

SMEMA, SECS/GEM

Cassette Positions Available

Up to 4 x 200mm Cassettes

MTBF

60,000 hours

Compliance Standards

CE, SEMI S2, SEMI S8

Uptime

>97%

Handling Capabilities
  • Thin Wafers
  • Warped Wafers
  • Thick Wafers
  • Glass Wafers
  • Bonded Wafers
  • Perforated Wafers
  • Trenched Wafers
  • Taiko Wafers