Jabil Chad Automation has been in the semiconductor automation industry for over 12 years. We have extensive experience with different wafer types, OEM process tools, and factory integration requirements. We offer custom wafer handling solutions ranging from basic sub-systems to full turnkey automation systems and utilize tools that enable us to provide leading-edge automation technology for the semiconductor industry.
The WaferMate™ automation platform handles a variety of substrates, including thin, warped, grooved, perforated, glass, film frames, and reticles. We can supply standard wafer handling solutions to meet your non-standard wafer handling requirements.
Warped (up to 6.6mm)